Product Description

Soft Annealed C26000 C27000 Rolled Brass Foil Roll for Heating Foils

Chemical Composition (%)

Alloy No.	Chemical Composition( %,Max.)
Alloy No.	Cu	Fe	Pb	Al	Mn	Sn	Ni	Zn	Impurity
H90	88.0-91.0	0.10	0.03	---	---	---	0.5	Rem	0.3
H85	84.0-86.0	0.10	0.03	---	---	---	0.5	Rem	0.3
H70	68.5-71.5	0.10	0.03	---	---	---	0.5	Rem	0.3
H68	67.0-70.0	0.10	0.03	---	---	---	0.5	Rem	0.3
H65	63.5-68.0	0.10	0.03	---	---	---	0.5	Rem	0.3

Alloy Table

China	ISO	ASTM	JIS
H90	CuZn10	C22000	C2200
H85	CuZn15	C23000	C2300
H70	CuZn30	C26000	C2600
H68	------	-------	------
H65	CuZn35	C27000	C2700

Physical Properties
Density:8.5g/cm3
Electric conductivity(20 °C ): 27%IACS
Thermal conductivity (20 °C): 120W/(m °C )
Elastic modulus: 105000N/mm2
Thermal expansion coefficient (20-300 °C ) 20 X 10 -6 °C -1

Specifications Available

Unit	Thickness	Width	Temper
mm	0.006~0.1	1.0~650	O,1/4H,1/2H,H
inch	0.0002~0.004	0.04~25.6	O,1/4H,1/2H,H

Sizes and Tolerances (mm)

Thickness	Thickness Tolerances	Width	Width Tolerances
0.006~0.04	± 0.001	1.0~650	± 0.1
> 0.04~0.10	± 0.002	1.0~650	± 0.1

Mechanical Properties

Temper	JIS Temper	Tensile Strength Rm/N/mm2	Elongation A50/%	Hardness HV
M	O	350~410	≥ 30	70~100
Y4	1/4H	380~445	≥ 20	105~145
Y2	1/2H	390~480	≥ 15	120~165
Y	H	460~510	≥ 10	135~185

Note: We can provide products with other properties according to customers` requirements.

Application:
High precision radiator foil is main material in manufacturing automobile, farmer machine, mining machinery, engineering machinery, diesel locomotive, shipbuilding, generator set.

Carried Standard(Latest)

Nations	Standard No.	Standard Name
China	GB/T2059--2000	CHINA'S NATIONAL STANDARD
Japan	JIS H3100 :2000	COPPER AND COPPER ALLOY SHEETS,PLATES AND STRIPS
U.S.A	ASTM B36/B 36M -01	STANDARD SPECIFICATION FOR BRASS,PLATE,SHEET,STRIP AND ROLLED BAR
Germany	DIN-EN 1652:1997	COPPER AND COPPER ALLOYS PLATE,SHEET,STRIP AND CIRCLES FOR GENERAL PURPOSES
Germany	DIN-EN 1758 :1997	COPPER AND COPPER ALLOYS STRIP FOR LEADFRAMES
SEMI	SEMI G4-0302	SPECIFICATION FOR INTERGRATED CIRCUIT LEADFRAME MATERIALS USED IN THE PRODUCTION OF STAMPED LEADFRAMES